1. 2. 3. material content data sheet sales product name ipi075n15n3 g issued 29. august 2013 ma# MA000771292 package pg-to262-3-1 weight* 1574.51 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 17.562 1.12 1.12 11154 11154 leadframe non noble metal iron 7439-89-6 0.957 0.06 608 inorganic material phosphorus 7723-14-0 0.287 0.02 182 non noble metal copper 7440-50-8 955.892 60.71 60.79 607107 607897 wire non noble metal aluminium 7429-90-5 9.761 0.62 0.62 6199 6199 encapsulation organic material carbon black 1333-86-4 5.688 0.36 3612 plastics epoxy resin - 108.068 6.86 68636 inorganic material silicondioxide 60676-86-0 455.025 28.90 36.12 288996 361244 leadfinish non noble metal tin 7440-31-5 15.198 0.97 0.97 9652 9652 plating non noble metal nickel 7440-02-0 0.228 0.01 145 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 145 solder non noble metal antimony 7440-36-0 0.584 0.04 371 noble metal silver 7440-22-4 1.460 0.09 927 non noble metal tin 7440-31-5 3.796 0.24 0.37 2411 3709 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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